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HD3SS3212RKSRQ1 - Texas Instruments

Description: Two-channel differential 2:1 & 1:2 USB3.2 mux & demux

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PCB Footprints
HD3SS3212RKSRQ1 - Texas Instruments PCB footprint - Other - Other - RKS0020A__2021
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3D Models
HD3SS3212RKSRQ1 - Texas Instruments  - 3D model - Other - RKS0020A__2021
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HD3SS3212RKSRQ1 Details

  • Manufacturer Part Number:

    HD3SS3212RKSRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2018-09-23

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    8000 MHz

  • JESD-30 Code:

    R-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Off-state Isolation-Nom:

    23 dB

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    0.8 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Switch-on Time-Max:

    500 ns

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

HD3SS3212RKSRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for the HD3SS3212RKSRQ1 involves keeping the high-speed signals away from the power planes, using a solid ground plane, and minimizing the length of the traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence, connect the VCC pin to a 1.8V power supply, and configure the MODE pin according to the desired operating mode. Also, make sure to connect the RESET pin to a 1.8V power supply or a pull-up resistor to ensure proper reset functionality.
  • The HD3SS3212RKSRQ1 has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat dissipation, such as using a heat sink or a thermal pad, and to keep the device away from heat sources.
  • To troubleshoot issues with the HD3SS3212RKSRQ1, start by checking the power supply voltage, signal integrity, and clock signal quality. Use oscilloscopes and logic analyzers to debug the signals and identify the root cause of the issue. Also, consult the datasheet and application notes for troubleshooting guidelines.
  • The HD3SS3212RKSRQ1 has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, grounding straps, and wrist straps to prevent damage to the device.

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HD3SS3212RKSRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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