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HD3SS3212RKST - Texas Instruments

Description: Texas Instruments HD3SS3212RKST, USB Transceiver, USB 3.1 2-Port at 10Gbit/s, 2.7 → 3.6 V, 20-Pin VQFN

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HD3SS3212RKST - Texas Instruments - PCB symbol
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PCB Footprints
HD3SS3212RKST - Texas Instruments PCB footprint - Other - Other - RKS0020A
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3D Models
HD3SS3212RKST - Texas Instruments - 3D model - Other - RKS0020A
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HD3SS3212RKST Details

  • Manufacturer Part Number:

    HD3SS3212RKST

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    8000 MHz

  • Input Voltage-Max:

    4.5 V

  • JESD-30 Code:

    R-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    2

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Off-state Isolation-Nom:

    75 dB

  • On-state Resistance Match-Nom:

    0.5 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    70 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.1X.18,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    0.8 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    500 ns

  • Switch-on Time-Max:

    500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

HD3SS3212RKST Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the high-speed signals away from the power planes. Additionally, use a common mode filter and a shielded cable for the USB interface to minimize EMI.
  • The HD3SS3212RKST requires a 1.8V to 3.3V power supply, and the power sequencing is critical. The VCCIO pin should be powered up first, followed by the VCC pin. The VCCIO pin should be powered down last to prevent damage to the device.
  • The HD3SS3212RKST has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. Ensure good airflow around the device, and consider using a heat sink or thermal interface material to reduce thermal resistance.
  • The HD3SS3212RKST can be configured for USB 3.0 or USB 2.0 operation by setting the USB_SEL pin high or low, respectively. In USB 3.0 mode, the device supports SuperSpeed data rates up to 5 Gbps, while in USB 2.0 mode, it supports High-Speed data rates up to 480 Mbps.
  • The HD3SS3212RKST has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.

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HD3SS3212RKST Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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