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HD3SS3212RKSTQ1 - Texas Instruments

Description: Two-Channel Differential 2:1/1:2 USB3.2 Mux/Demux

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HD3SS3212RKSTQ1 - Texas Instruments - PCB symbol
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HD3SS3212RKSTQ1 - Texas Instruments PCB footprint - Other - Other - HD3SS3212RKSTQ1-2
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HD3SS3212RKSTQ1 - Texas Instruments - 3D model - Other - HD3SS3212RKSTQ1-2
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HD3SS3212RKSTQ1 Details

  • Manufacturer Part Number:

    HD3SS3212RKSTQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    8000 MHz

  • JESD-30 Code:

    R-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Off-state Isolation-Nom:

    23 dB

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    0.8 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Switch-on Time-Max:

    500 ns

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

HD3SS3212RKSTQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE25, which includes guidelines for component placement, routing, and grounding to minimize EMI and ensure signal integrity.
  • The HD3SS3212RKSTQ1 is configured for USB 3.2 Gen 2 operation by setting the MODE pin to a logic high and the SPEED pin to a logic low. Additionally, the device must be powered by a 3.3V supply and the VBUS pin must be connected to a 5V supply.
  • The HD3SS3212RKSTQ1 supports cable lengths up to 3 meters for USB 3.2 Gen 2 operation, assuming a high-quality cable with minimal attenuation and dispersion.
  • The HD3SS3212RKSTQ1 has a built-in power management feature that can be controlled through the PMODE pin. By setting the PMODE pin to a logic high, the device enters a low-power state, reducing power consumption. Additionally, the device can be powered down completely by setting the EN pin to a logic low.
  • The HD3SS3212RKSTQ1 has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, the device has a thermal shutdown feature that disables the device when the junction temperature exceeds 150°C.

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HD3SS3212RKSTQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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