CHIP CARRIER, HEAT SINK/SLUG, VERY VERY THIN PROFILE
Peak Reflow Temperature (Cel):
260
Seated Height-Max:
0.8 mm
Supply Current-Max (Isup):
0.8 mA
Supply Voltage-Max (Vsup):
3.6 V
Supply Voltage-Min (Vsup):
3 V
Supply Voltage-Nom (Vsup):
3.3 V
Surface Mount:
YES
Switch-off Time-Max:
0.5 ns
Switch-on Time-Max:
0.5 ns
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
NO LEAD
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
3.5 mm
HD3SS3411IRWAR Frequently Asked Questions (FAQs)
A good PCB layout for the HD3SS3411IRWAR involves keeping the high-speed signals away from the power planes, using a solid ground plane, and placing the decoupling capacitors close to the device. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help to reduce EMI.
The HD3SS3411IRWAR requires a 1.8V power supply for the digital core and a 3.3V power supply for the analog circuitry. The power sequencing requirement is to power up the 1.8V supply first, followed by the 3.3V supply. It's also recommended to use a power-on reset circuit to ensure the device is properly reset during power-up.
The HD3SS3411IRWAR has a maximum junction temperature of 125°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the airflow around the device. Additionally, follow the recommended PCB layout guidelines to minimize thermal resistance.
The HD3SS3411IRWAR can be configured for different USB modes using the MODE_SEL pins. For USB 2.0 mode, tie MODE_SEL1 low and MODE_SEL0 low. For USB 3.0 mode, tie MODE_SEL1 high and MODE_SEL0 low. For USB 3.2 Gen 1 mode, tie MODE_SEL1 high and MODE_SEL0 high. Additionally, the device can be configured using the I2C interface.
The HD3SS3411IRWAR has built-in ESD protection, but additional protection measures can be taken to ensure the device is protected from ESD events. Use ESD protection devices, such as TVS diodes, on the USB data lines and power lines. Additionally, follow proper handling and storage procedures to prevent ESD damage.
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HD3SS3411IRWAR Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
