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IPN60R3K4CE - Infineon

Description: Transistor=N-Channel Power MOSFET, ID=2.6A, IDpuls=3.9A, Mounting=SMT, Temperature=-40°C 150°C, Ptot=5W, Package=SOT-223, QG=4.6nC, Qgd=2.6nC, RDS=3400mΩ, RthJA=75K/W, VDS=600V, VGS=2.5V 3.5V

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IPN60R3K4CE - Infineon PCB footprint - Other - Other - IPN60R3K4CE
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IPN60R3K4CE Details

  • Manufacturer Part Number:

    IPN60R3K4CE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Germany, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    2.6 A

  • Drain-source On Resistance-Max:

    3.4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPN60R3K4CE Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the IPN60R3K4CE is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. As a general rule, it's recommended to operate the device within the boundaries of the SOA curves provided in the datasheet to ensure reliable operation.
  • The junction-to-case thermal resistance (RthJC) for the IPN60R3K4CE is not directly provided in the datasheet. However, it can be calculated using the thermal resistance values provided in the datasheet, such as RthJA (junction-to-ambient) and RthCS (case-to-sink). The calculation involves subtracting RthCS from RthJA to obtain RthJC.
  • The recommended gate drive voltage for the IPN60R3K4CE is not explicitly stated in the datasheet. However, as a general rule, it's recommended to use a gate drive voltage between 10V and 15V to ensure reliable switching and minimize power losses.
  • The IPN60R3K4CE is a high-speed power MOSFET, but its suitability for high-frequency switching applications depends on the specific requirements of the application. The device's switching characteristics, such as its rise and fall times, should be evaluated to ensure they meet the requirements of the application. Additionally, the device's thermal performance and power losses should be considered to ensure reliable operation.
  • To ensure proper cooling of the IPN60R3K4CE, it's essential to provide a suitable heat sink and thermal interface material (TIM) to dissipate heat away from the device. The heat sink should be designed to provide adequate thermal conductivity, and the TIM should be chosen to minimize thermal resistance. Additionally, the device's thermal performance should be evaluated to ensure it operates within its recommended temperature range.

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