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IPN80R4K5P7ATMA1 - Infineon

Description: MOSFET LOW POWER_NEW

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IPN80R4K5P7ATMA1 - Infineon PCB footprint - Other - Other -  PG-SOT223-3-1
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3D Models
IPN80R4K5P7ATMA1 - Infineon  - 3D model - Other -  PG-SOT223-3-1
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IPN80R4K5P7ATMA1 Details

  • Manufacturer Part Number:

    IPN80R4K5P7ATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    800 V

  • Drain-source On Resistance-Max:

    4.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IPN80R4K5P7ATMA1 Frequently Asked Questions (FAQs)

  • The IPN80R4K5P7ATMA1 can operate from -40°C to 150°C, with a junction temperature range of -40°C to 175°C.
  • The device has an exposed pad on the bottom for heat dissipation. Ensure good thermal contact between the pad and a heat sink or PCB thermal plane to maintain a low junction temperature.
  • Use a 4-layer PCB with a solid ground plane and a separate power plane for the device. Keep the power traces short and wide, and use a common ground point for the device and other components.
  • Use a PCB with thick copper traces (at least 2 oz) and ensure the device is properly cooled. Consider using a heat sink or thermal interface material to improve heat dissipation.
  • The IPN80R4K5P7ATMA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device, such as using an ESD wrist strap or mat.

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IPN80R4K5P7ATMA1 Overview

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