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ISO35TDW - Texas Instruments

Description: Isolated 3.3V Full-Duplex RS-485 Transceiver with Integrated Transformer Driver

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ISO35TDW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0016B
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ISO35TDW - Texas Instruments  - 3D model - Small Outline Packages - DW0016B
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ISO35TDW Details

  • Manufacturer Part Number:

    ISO35TDW

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    115 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    27 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    340 ns

  • Width:

    7.5 mm

ISO35TDW Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISO35TDW involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. TI provides a recommended PCB layout in the application note SLUA623.
  • The ISO35TDW requires a dual power supply (VCC and VEE) with a minimum of 4.5V and a maximum of 5.5V. Decoupling capacitors (0.1uF and 10uF) should be placed close to the power pins to filter out noise and ensure stable operation.
  • The ISO35TDW can support data rates up to 100 Mbps, but the actual data rate depends on the specific application, cable length, and noise environment. TI recommends using a shielded cable and following proper termination and layout guidelines to achieve the highest data rates.
  • The ISO35TDW has built-in ESD protection, but additional protection measures can be taken. Use TVS diodes or ESD protection devices on the input lines, and consider adding common-mode chokes or filters to reduce electromagnetic interference (EMI).
  • The ISO35TDW has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and follow proper PCB thermal design guidelines to prevent overheating. Monitor the device's thermal performance and adjust the design accordingly.

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ISO35TDW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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