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ISO5852SMDWREP - Texas Instruments

Description: High-CMTI 2.5-A / 5-A Isolated IGBT, MOSFET Gate Driver

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ISO5852SMDWREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW (R-PDSO-G16)
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ISO5852SMDWREP - Texas Instruments  - 3D model - Small Outline Packages - DW (R-PDSO-G16)
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ISO5852SMDWREP Details

  • Manufacturer Part Number:

    ISO5852SMDWREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2016-12-25

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Side Driver:

    NO

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    AND GATE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    STANDARD

  • Output Current-Max:

    5 A

  • Output Peak Current Limit-Nom:

    2.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    30 V

  • Supply Voltage1-Min:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.11 µs

  • Turn-on Time:

    0.11 µs

  • Width:

    7.5 mm

ISO5852SMDWREP Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, which includes guidelines for component placement, trace routing, and thermal management. Following this layout ensures optimal performance, reduced EMI, and improved reliability.
  • Proper power supply decoupling is crucial for the ISO5852SMDWREP. Use a low-ESR capacitor (e.g., 10uF) close to the device, and ensure the power supply rails are well-filtered and regulated. Additionally, follow the recommended power-up and power-down sequencing in the datasheet.
  • The ISO5852SMDWREP has a maximum junction temperature of 150°C. Ensure good thermal conductivity by using a thermal pad or heat sink, and follow the recommended PCB layout for thermal management. Avoid overheating by keeping the device within the recommended operating temperature range.
  • Start by reviewing the datasheet and application notes for common pitfalls and troubleshooting guidelines. Use oscilloscopes or logic analyzers to debug signal integrity issues. Check for proper power supply, decoupling, and thermal management. If issues persist, consult Texas Instruments' support resources or contact their technical support team.
  • Yes, the ISO5852SMDWREP is a high-speed digital isolator, and EMI/EMC considerations are crucial. Follow the recommended PCB layout, use shielding, and implement proper grounding and filtering techniques to minimize EMI. Ensure compliance with relevant EMC standards and regulations.

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ISO5852SMDWREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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