Part Image

ISP817XSM - Isocom

Description: ISOCOM - ISP817XSM - OPTOCOUPLER, SMDIP-4, TR O/P

Download ISP817XSM Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
ISP817XSM - Isocom PCB footprint - Small Outline Packages - Small Outline Packages - ISP817
click to zoom
3D Models
ISP817XSM - Isocom  - 3D model - Small Outline Packages - ISP817
click to zoom

ISP817XSM Details

  • Manufacturer Part Number:

    ISP817XSM

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    Isocom Components

  • YTEOL:

    7.5

  • Additional Feature:

    UL RECOGNIZED, VDE APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    35 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    50%

  • Current Transfer Ratio-Nom:

    50%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    5300 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -30 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000018 s

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

ISP817XSM Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode choke or ferrite bead to filter the power supply.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow around the device. Derate the power supply voltage and current according to the datasheet's thermal derating curve.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output lines. Follow the recommended PCB layout and handling procedures to prevent ESD damage.
  • Yes, but ensure the device is properly bypassed and filtered to minimize electromagnetic interference (EMI). Use a suitable output filter and follow the recommended PCB layout to reduce EMI.
  • Use an oscilloscope to check the input and output waveforms. Verify the power supply voltage and current. Check for overheating, ESD damage, or incorrect PCB layout. Consult the datasheet and application notes for troubleshooting guidelines.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

ISP817XSM Overview

Use the download button to access the ISP817XSM schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ISP81, or try a keyword search, such as Optocoupler

Parts related to ISP817XSM

Showing 0 results