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LM4040QBIM3X2.5/NOPB - Texas Instruments

Description: Automotive 100-ppm/°C precision micropower shunt voltage reference

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LM4040QBIM3X2.5/NOPB - Texas Instruments - PCB symbol
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PCB Footprints
LM4040QBIM3X2.5/NOPB - Texas Instruments PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - DBZ (R-PDSO-G3)
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LM4040QBIM3X2.5/NOPB - Texas Instruments - 3D model - SOT23 (3-Pin) - DBZ (R-PDSO-G3)
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LM4040QBIM3X2.5/NOPB Details

  • Manufacturer Part Number:

    LM4040QBIM3X2.5/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    TWO TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    2.505 V

  • Output Voltage-Min:

    2.495 V

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    100 ppm/°C

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.2%

  • Width:

    1.3 mm

LM4040QBIM3X2.5/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-grounded layout with a solid ground plane to minimize noise and ensure stability. Additionally, keep the input and output capacitors close to the device and use short, wide traces to reduce inductance.
  • The LM4040QBIM3X2.5/NOPB has a thermal pad that must be connected to a solid ground plane or a thermal relief pattern to dissipate heat. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or a heat sink if high power dissipation is expected.
  • A 1-10uF X7R or X5R ceramic capacitor is recommended for the input capacitor, depending on the input voltage and noise requirements. The capacitor should be placed close to the device and connected between the input pin and ground.
  • Yes, the LM4040QBIM3X2.5/NOPB is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and is manufactured using a robust process that ensures high reliability and low defect rates.
  • Consult the datasheet and application notes for specific biasing and configuration guidelines. Additionally, consider using the TI WEBENCH Power Designer tool to simulate and optimize your design before prototyping.

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LM4040QBIM3X2.5/NOPB Overview

Use the download button to access the LM4040QBIM3X2.5/NOPB schematic symbol, PCB footprint, and 3D model.
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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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