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LM48312TLE/NOPB - Texas Instruments

Description: Audio Amplifiers 2.6W, Ultra-Low EMI, Filterless, Mono Class D Audio Power Amplifier with E2S 9-DSBGA -40 to 85

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LM48312TLE/NOPB - Texas Instruments - PCB symbol
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PCB Footprints
LM48312TLE/NOPB - Texas Instruments PCB footprint - BGA - BGA - YZR0009_1
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LM48312TLE/NOPB - Texas Instruments - 3D model - BGA - YZR0009_1
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LM48312TLE/NOPB Details

  • Manufacturer Part Number:

    LM48312TLE/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PBGA-B9

  • JESD-609 Code:

    e1

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Noise Figure-Nom:

    95 dB

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    2.6 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA9,3X3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.675 mm

  • Supply Current-Max:

    3.9 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.8 mm

LM48312TLE/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as keeping the power traces short and wide, using a solid ground plane, and minimizing signal trace lengths and vias.
  • The LM48312TLE/NOPB has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Also, follow the recommended operating temperature range and power dissipation guidelines.
  • A low-ESR ceramic capacitor (X5R or X7R dielectric) with a value of 2.2uF to 4.7uF is recommended for the input capacitor. This helps to filter out high-frequency noise and ensure stable operation.
  • Yes, the LM48312TLE/NOPB is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive applications and is also suitable for industrial and medical applications. However, ensure that the device is used within its recommended operating conditions and follows the recommended design guidelines.
  • Start by checking the PCB layout and ensuring that it follows the recommended guidelines. Verify that the input and output capacitors are properly selected and placed. Check for any signs of overheating or thermal issues. Use an oscilloscope to measure the output voltage and current, and look for any signs of oscillation or instability. Consult the datasheet and application notes for troubleshooting guidelines and tips.

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LM48312TLE/NOPB Overview

Use the download button to access the LM48312TLE/NOPB schematic symbol, PCB footprint, and 3D model.
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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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