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LM66100QDCKRQ1 - Texas Instruments

Description: Power Management Specialized - PMIC Automotive 1.5-V to 5.5-V, 1.5-A, 0.5-uA IQ ideal diode with integrated FET

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PCB Footprints
LM66100QDCKRQ1 - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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3D Models
LM66100QDCKRQ1 - Texas Instruments  - 3D model - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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LM66100QDCKRQ1 Details

  • Manufacturer Part Number:

    LM66100QDCKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    INPUT FAULT PROTECTION CONTROLLER

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    1.5 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.5 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

LM66100QDCKRQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Place the device near a thermal pad or a heat sink to improve heat dissipation.
  • Use a soft-start circuit to limit the inrush current during start-up. For shutdown, ensure a controlled ramp-down of the output voltage to prevent voltage spikes.
  • Use a common-mode choke, X-capacitors, and Y-capacitors to filter out electromagnetic interference (EMI). Ensure the filter components are placed close to the device and the PCB layout is optimized for EMI reduction.
  • Use the device's low-power mode (LPM) feature, which reduces the quiescent current. Additionally, consider using a low-dropout regulator (LDO) for the bias supply to minimize standby power consumption.
  • Ensure good thermal contact between the device and the heat sink. Use thermal interface material (TIM) to fill gaps and reduce thermal resistance. A heat sink with a thermal resistance of <1°C/W is recommended.

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LM66100QDCKRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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