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LM74700MDDFREP - Texas Instruments

Description: Enhanced Ideal Diode Controller

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LM74700MDDFREP - Texas Instruments - PCB symbol
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PCB Footprints
LM74700MDDFREP - Texas Instruments PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - DDF0008A_(H=1.1mm)
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3D Models
LM74700MDDFREP - Texas Instruments - 3D model - SOT23 (8-Pin) - DDF0008A_(H=1.1mm)
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LM74700MDDFREP Details

  • Manufacturer Part Number:

    LM74700MDDFREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INPUT FAULT PROTECTION CONTROLLER

  • Input Voltage-Max:

    65 V

  • Input Voltage-Min:

    3.2 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -50 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.11

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    65 V

  • Supply Voltage-Min (Vsup):

    3.2 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.8V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

LM74700MDDFREP Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a low-thermal-resistance path from the device to the heat sink or PCB ground plane.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and adequate airflow. Monitor the device's junction temperature (TJ) and ensure it stays within the recommended operating range.
  • Choose an input capacitor with a high ripple current rating, low ESR, and a voltage rating that exceeds the maximum input voltage. A 10-22 μF ceramic or film capacitor is a good starting point.
  • Use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and add a common-mode choke or EMI filter to reduce conducted emissions. Ensure good PCB layout practices, such as separating analog and digital grounds.
  • Choose an output capacitor with a high ripple current rating, low ESR, and a voltage rating that exceeds the maximum output voltage. Place the capacitor close to the device's output pins and ensure a low-inductance path to the output.

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LM74700MDDFREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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