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LMH6642QMF/NOPB - Texas Instruments

Description: Automotive, Low power 130MHz 75mA Rail to Rail Output Amp

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LMH6642QMF/NOPB - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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LMH6642QMF/NOPB - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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LMH6642QMF/NOPB Details

  • Manufacturer Part Number:

    LMH6642QMF/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    3.25 µA

  • Bandwidth (3dB)-Nom:

    46 MHz

  • Bias Current-Max (IIB) @25C:

    2.6 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.8 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.75 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.22 mm

  • Slew Rate-Min:

    100 V/us

  • Slew Rate-Nom:

    135 V/us

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage Limit-Max:

    6.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.953 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Gain-Min:

    5011.872

  • Wideband:

    NO

  • Width:

    1.6 mm

LMH6642QMF/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout with a solid ground plane, short traces, and decoupling capacitors close to the power pins. A 4-layer PCB with a dedicated analog ground plane is also recommended. See the TI application note 'AN-1112: PCB Layout for Switching Regulators and Op Amps' for more details.
  • The output capacitor should be chosen based on the desired closed-loop bandwidth and stability. A general rule of thumb is to use a capacitor with a value between 10nF to 100nF. The capacitor should also have a low ESR (Equivalent Series Resistance) to minimize ringing and oscillations.
  • Yes, the LMH6642QMF/NOPB can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance to prevent signal attenuation. Additionally, the output impedance of the op-amp should be considered when driving a load.
  • The thermal shutdown feature is designed to protect the device from overheating. If the device exceeds the thermal shutdown threshold (typically 150°C), it will shut down. To handle this, ensure proper heat sinking, use a thermal pad or heat sink, and avoid operating the device near its maximum power rating.
  • The recommended input common-mode voltage range for the LMH6642QMF/NOPB is between VCC-1.5V and VCC+0.5V. Operating outside this range may affect the device's performance and stability.

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LMH6642QMF/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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