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LMP7731MF - Texas Instruments

Description: Amplifier

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LMP7731MF - Texas Instruments PCB footprint - Other - Other - SOT95P284X119-5N
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LMP7731MF - Texas Instruments  - 3D model - Other - SOT95P284X119-5N
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LMP7731MF Details

  • Manufacturer Part Number:

    LMP7731MF

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 5 PIN

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.075 µA

  • Bias Current-Max (IIB) @25C:

    0.075 µA

  • Common-mode Reject Ratio-Min:

    99 dB

  • Common-mode Reject Ratio-Nom:

    129 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    600 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e0

  • Length:

    2.92 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.19 mm

  • Slew Rate-Nom:

    2.4 V/us

  • Supply Current-Max:

    3.9 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.953 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    21000

  • Voltage Gain-Min:

    31622.77

  • Wideband:

    NO

  • Width:

    1.6 mm

LMP7731MF Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow a star-ground layout, keep the input and output traces short and separate, and use a solid ground plane. Additionally, place decoupling capacitors close to the power pins and use a low-ESR capacitor for the bypass capacitor.
  • To minimize EMI and RFI susceptibility, use a shielded enclosure, keep the op-amp away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines. Also, ensure good PCB layout practices, such as keeping the input and output traces short and separate.
  • The maximum power dissipation of the LMP7731MF is dependent on the package type and ambient temperature. For the MF package, the maximum power dissipation is 670mW at 25°C. To calculate the power dissipation, use the formula: Pd = (Vcc x Icc) + (Vout x Iout), where Vcc is the supply voltage, Icc is the quiescent current, Vout is the output voltage, and Iout is the output current.
  • Yes, the LMP7731MF can be used as a unity-gain buffer. However, consider the input bias current and offset voltage, which can affect the output voltage. Also, ensure the output impedance of the source is low enough to drive the input of the op-amp, and consider adding a resistor in series with the input to improve stability.
  • Choose a bypass capacitor with a low equivalent series resistance (ESR) and a high self-resonant frequency. A 10nF to 100nF ceramic capacitor with an ESR of less than 1 ohm is a good starting point. The capacitor should be placed close to the power pins and connected to a solid ground plane.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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