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LMP8481MM-S/NOPB - Texas Instruments

Description: 76-V, Bi-Directional, High-Side, High-Speed, Voltage Output Current Sensing Amplifier

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LMP8481MM-S/NOPB - Texas Instruments - PCB symbol
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PCB Footprints
LMP8481MM-S/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK (S-PDSO-G8)
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LMP8481MM-S/NOPB - Texas Instruments - 3D model - Small Outline Packages - DGK (S-PDSO-G8)
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LMP8481MM-S/NOPB Details

  • Manufacturer Part Number:

    LMP8481MM-S/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    12 µA

  • Bandwidth (3dB)-Nom:

    0.27 MHz

  • Common Mode Voltage-Max:

    76 V

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    124 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    265 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    0.155 mA

  • Supply Voltage Limit-Max:

    85 V

  • Supply Voltage-Nom (Vsup):

    16 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    270

  • Voltage Gain-Min:

    59.5

  • Voltage Gain-Nom:

    60

  • Wideband:

    NO

  • Width:

    3 mm

LMP8481MM-S/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMP8481MM involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a separate analog and digital ground plane to minimize noise coupling.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, the input and output capacitors should be selected based on the specific application requirements, and the device should be operated within its recommended operating conditions.
  • The maximum power dissipation of the LMP8481MM is dependent on the ambient temperature and the thermal resistance of the package. The power dissipation can be calculated using the formula: Pd = (Vin - Vout) x Iout. It's essential to ensure that the device operates within its recommended power dissipation limits to prevent overheating.
  • The LMP8481MM is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the device's thermal characteristics and ensure that it operates within its recommended temperature range for optimal performance and reliability.
  • To protect the LMP8481MM from input voltage transients and surges, it's recommended to use input capacitors with a high voltage rating and a low equivalent series resistance (ESR). Additionally, using a voltage transient suppressor or a surge protector can help to absorb voltage spikes and surges.

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LMP8481MM-S/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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