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LMP8481MME-H/NOPB - Texas Instruments

Description: Current Sense Amplifiers Prec 76V Hi-Side Cnt Sense Amp w Vout

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LMP8481MME-H/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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LMP8481MME-H/NOPB Details

  • Manufacturer Part Number:

    LMP8481MME-H/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    12 µA

  • Bandwidth (3dB)-Nom:

    0.27 MHz

  • Common Mode Voltage-Max:

    76 V

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    124 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    265 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    0.155 mA

  • Supply Voltage Limit-Max:

    85 V

  • Supply Voltage-Nom (Vsup):

    16 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    270

  • Voltage Gain-Min:

    99.2

  • Voltage Gain-Nom:

    100

  • Wideband:

    NO

  • Width:

    3 mm

LMP8481MME-H/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMP8481MME-H/NOPB involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the input and output capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The choice of input and output capacitors for the LMP8481MME-H/NOPB depends on the specific application and the desired performance. In general, X5R or X7R ceramic capacitors with a voltage rating of 10V or higher are recommended. The capacitance value should be chosen based on the desired ripple rejection and noise filtering requirements.
  • The maximum power dissipation of the LMP8481MME-H/NOPB is 1.4W. To ensure it doesn't overheat, it's recommended to provide adequate heat sinking, such as a thermal pad or a heat sink, and to keep the device in a well-ventilated area. Additionally, the device should be operated within the recommended operating temperature range of -40°C to 125°C.
  • Yes, the LMP8481MME-H/NOPB can be used in high-temperature environments, but with some limitations. The device is rated for operation up to 125°C, but the maximum junction temperature should not exceed 150°C. Additionally, the device's performance and reliability may degrade at high temperatures, so it's recommended to derate the device's power dissipation and operating frequency accordingly.
  • To ensure the LMP8481MME-H/NOPB is properly biased and configured, follow the recommended application circuit and biasing scheme outlined in the datasheet. Additionally, ensure that the input and output voltages are within the recommended operating range, and that the device is properly decoupled with capacitors.

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LMP8481MME-H/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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