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LMV772QMM/NOPB - Texas Instruments

Description: Single/Dual/Quad, Low Offset, Low Noise, RRO Operational Amplifiers

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LMV772QMM/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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LMV772QMM/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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LMV772QMM/NOPB Details

  • Manufacturer Part Number:

    LMV772QMM/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00025 µA

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0001 µA

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1.4 V/us

  • Supply Current-Max:

    1.9 mA

  • Supply Voltage Limit-Max:

    5.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3500

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

LMV772QMM/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground configuration, with the op-amp's ground pin connected to a central ground point. Additionally, keep the input and output traces short and away from noise sources, and use a solid ground plane to reduce EMI.
  • To ensure stability, make sure the op-amp is operated within its recommended supply voltage range, and that the feedback network is properly designed to avoid oscillations. Also, check for any capacitive loads that may affect stability, and consider adding a compensation capacitor if necessary.
  • The maximum power dissipation of the LMV772QMM/NOPB is 1.4W, which is calculated based on the maximum junction temperature (150°C) and the thermal resistance of the package (θJA = 90°C/W). Make sure to keep the device within this power dissipation limit to avoid overheating.
  • The LMV772QMM/NOPB is rated for operation up to 125°C, but its performance may degrade at higher temperatures. If your application requires operation above 125°C, consider using a different op-amp or taking additional thermal management measures.
  • The LMV772QMM/NOPB has built-in ESD protection, but it's still important to follow proper handling and storage procedures to prevent ESD damage. Use an ESD wrist strap or mat, and avoid touching the device's pins or exposed internal components.

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LMV772QMM/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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