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LP8765RLX/NOPB - Texas Instruments

Description: IC PMU CHRGR 1.2A OVP 49SMDXT

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PCB Footprints
LP8765RLX/NOPB - Texas Instruments PCB footprint - BGA - BGA - 25-bump Thin micro SMD Package
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3D Models
LP8765RLX/NOPB - Texas Instruments  - 3D model - BGA - 25-bump Thin micro SMD Package
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LP8765RLX/NOPB Details

  • Manufacturer Part Number:

    LP8765RLX/NOPB

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B49

  • JESD-609 Code:

    e2

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    49

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA49,7X7,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Nom (Vsup):

    3.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

LP8765RLX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the LP8765 application note (SLUUAC5) that includes thermal vias, copper pours, and component placement guidelines to minimize thermal resistance and ensure optimal performance.
  • The LP8765 has a variety of configuration options, and Texas Instruments provides a configuration tool (LP8765 Config Tool) that allows you to select the desired settings and generate a configuration file that can be loaded into the device.
  • The recommended input capacitor value is 10uF to 22uF, and a low-ESR ceramic capacitor (such as X5R or X7R) is recommended to minimize input ripple and ensure stable operation.
  • Texas Instruments provides a troubleshooting guide (SLUUAC6) that covers common issues and their solutions, including debugging techniques, oscilloscope measurements, and component checks.
  • The LP8765 is rated for operation up to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. Above 125°C, the device's performance and reliability may be affected, and additional thermal design considerations may be necessary.

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LP8765RLX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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