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LT6660HCDC-5#TRMPBF - Analog Devices

Description: LINEAR TECHNOLOGY - LT6660HCDC-5#TRMPBF - Voltage Reference, Micropower, Series - Fixed, LT6660 Series, 5V, DFN-3

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LT6660HCDC-5#TRMPBF - Analog Devices PCB footprint - Other - Other - DC Package 3-Lead Plastic DFN (2mm × 2mm)
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LT6660HCDC-5#TRMPBF - Analog Devices  - 3D model - Other - DC Package 3-Lead Plastic DFN (2mm × 2mm)
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LT6660HCDC-5#TRMPBF Details

  • Manufacturer Part Number:

    LT6660HCDC-5#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    2 X 2 MM, 0.75 MM, PLASTIC, MO-229W-TBD, DFN-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    05-08-1717

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    S-PSSO-N3

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    5.01 V

  • Output Voltage-Min:

    4.99 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSON

  • Package Equivalence Code:

    SILCC3,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    5.9 V

  • Supply Voltage-Nom (Vsup):

    7.5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    20 ppm/°C

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Width:

    2 mm

LT6660HCDC-5#TRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT6660 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and EMI.
  • To ensure stability, ensure that the output capacitor is properly sized, the input capacitor is properly bypassed, and the device is operated within its recommended operating conditions. Additionally, adding a small capacitor (e.g. 10nF) between the VOUT and GND pins can help prevent oscillations.
  • The maximum output current capability of the LT6660 is 20mA, but this can be limited by the input voltage, output voltage, and internal power dissipation. Be sure to check the device's power dissipation and thermal characteristics to ensure reliable operation.
  • Yes, the LT6660 can be used as a voltage reference for other circuits. Its low noise and high stability make it suitable for this application. However, be sure to consider the output impedance and load regulation when designing the reference circuit.
  • The LT6660 has a maximum junction temperature of 150°C. Ensure good thermal conduction by using a thermally conductive PCB material, and consider adding a heat sink or thermal pad to the device. Also, be mindful of the device's power dissipation and thermal resistance.

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LT6660HCDC-5#TRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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