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LTC1274ISW#TRPBF - Analog Devices

Description: 12 Bit Analog to Digital Converter 1 Input 1 SAR 24-SOIC

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LTC1274ISW#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - SOIC_W-1
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LTC1274ISW#TRPBF Details

  • Manufacturer Part Number:

    LTC1274ISW#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SO-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    05-08-1620 (SW24)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Input Voltage-Max:

    4.096 V

  • Conversion Time-Max:

    8 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    15.4 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Negative Supply Voltage-Nom:

    -5 V

  • Number of Analog In Channels:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.1 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    4 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

LTC1274ISW#TRPBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC1274ISW can be found in the application note AN70, which provides guidelines for PCB layout, component placement, and thermal management to ensure optimal performance and minimize noise.
  • The choice of input and output capacitors depends on the specific application requirements, such as ripple current, voltage rating, and ESR. A good starting point is to use low-ESR capacitors with a voltage rating of at least 2x the input voltage, and follow the guidelines in the datasheet and application notes.
  • The maximum ambient temperature for the LTC1274ISW is 85°C, but it can be derated for higher temperatures. It's essential to consider the thermal management and heat dissipation in the system design to ensure reliable operation.
  • Yes, the LTC1274ISW is available in a variety of grades, including the 'SW' grade, which is suitable for high-reliability and aerospace applications. However, it's essential to consult with Analog Devices Inc. and follow the relevant qualification and testing procedures for these applications.
  • Common issues with the LTC1274ISW can often be resolved by checking the PCB layout, component values, and input/output connections. Consult the datasheet, application notes, and Analog Devices Inc.'s technical support resources for troubleshooting guides and FAQs.

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LTC1274ISW#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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