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LTC2311HMSE-12#PBF - Analog Devices

Description: 12-Bit + Sign, 5Msps Differential Input ADC with Wide Input Common Mode Range

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LTC2311HMSE-12#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC2311HMSE-12#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 16-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1667 Rev F)
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3D Models
LTC2311HMSE-12#PBF - Analog Devices - 3D model - Small Outline Packages - MSE Package 16-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1667 Rev F)
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LTC2311HMSE-12#PBF Details

  • Manufacturer Part Number:

    LTC2311HMSE-12#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HTSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1667

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog Input Voltage-Max:

    2.054 V

  • Analog Input Voltage-Min:

    -2.042 V

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP16,.19,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    5 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    12 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC2311HMSE-12#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2311 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the analog and digital sections. A 4-layer PCB with a dedicated analog ground plane is recommended. Additionally, the datasheet provides a recommended PCB layout and land pattern that should be followed.
  • To ensure accurate timing and synchronization, it is essential to use a high-quality clock source, such as a crystal oscillator or a low-jitter clock generator. The LTC2311 also has a clock synchronization feature that allows it to synchronize with an external clock source. Additionally, the device has a built-in phase-locked loop (PLL) that can be used to generate a stable clock signal.
  • The maximum data transfer rate of the LTC2311 depends on the specific configuration and the speed grade of the device. The -12 speed grade of the LTC2311 can achieve a maximum data transfer rate of up to 105 MSPS. However, the actual data transfer rate may be limited by the system's bandwidth, noise, and other factors.
  • The LTC2311 has built-in overvoltage and undervoltage protection features. The device can detect overvoltage and undervoltage conditions and respond accordingly. For example, if an overvoltage condition is detected, the device can shut down to prevent damage. Additionally, the device has a power-on reset (POR) feature that ensures the device is in a known state after power-up.
  • The recommended power supply decoupling for the LTC2311 involves using a combination of ceramic and electrolytic capacitors to filter out noise and ripple. A 0.1uF ceramic capacitor should be placed close to the device's power pins, and a 10uF electrolytic capacitor should be placed further away from the device. Additionally, the power supply lines should be routed away from the analog signal lines to minimize noise coupling.

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LTC2311HMSE-12#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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