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LTC2312ITS8-12#TRMPBF - Analog Devices

Description: 12-Bit, 500ksps Serial Sampling ADC in TSOT

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PCB Footprints
LTC2312ITS8-12#TRMPBF - Analog Devices PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - TS8 Package 8-Lead Plastic TSOT-23
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LTC2312ITS8-12#TRMPBF - Analog Devices  - 3D model - SOT23 (8-Pin) - TS8 Package 8-Lead Plastic TSOT-23
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LTC2312ITS8-12#TRMPBF Details

  • Manufacturer Part Number:

    LTC2312ITS8-12#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOT-23, 8 PIN

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1637

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    2.056 V

  • Conversion Time-Max:

    1.4 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Linearity Error-Max (EL):

    0.0366%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    0.5 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    4.3 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.625 mm

LTC2312ITS8-12#TRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2312 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the analog signal traces. Additionally, it's recommended to place the ADC near the analog signal sources and to use a star-grounding configuration.
  • To ensure accurate conversions with the LTC2312, it's essential to provide a clean and stable power supply, use a low-noise reference voltage, and minimize noise coupling into the analog inputs. Additionally, proper PCB layout, grounding, and shielding can help reduce noise and ensure accurate conversions.
  • The maximum sampling rate of the LTC2312 is 1.5Msps (mega-samples per second). However, the actual sampling rate may be limited by the system's clock frequency, the conversion time, and the settling time of the analog inputs.
  • Yes, the LTC2312 can be used with an external reference voltage. The device has a dedicated REF pin that can be connected to an external reference voltage source. The external reference voltage should be within the specified range of 2.5V to 5.5V.
  • The LTC2312 can be interfaced with a microcontroller using the SPI (Serial Peripheral Interface) bus. The microcontroller can be used to control the ADC's operation, read the conversion results, and provide the clock signal for the ADC.

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LTC2312ITS8-12#TRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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