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LTC2856IMS8-2#TRPBF - Analog Devices

Description: Single Transmitter/Receiver RS-422/RS-485 Automotive 8-Pin MSOP T/R

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LTC2856IMS8-2#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP
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LTC2856IMS8-2#TRPBF Details

  • Manufacturer Part Number:

    LTC2856IMS8-2#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485-A; TIA-485-A; EIA-422

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    70 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1500 ns

  • Width:

    3 mm

LTC2856IMS8-2#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2856 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. A 4-layer PCB with a dedicated ground plane is recommended. Additionally, the datasheet provides a recommended PCB layout and land pattern that should be followed.
  • To ensure proper power-up and configuration, follow the power-up sequence outlined in the datasheet. Apply the analog supply voltage (VCC) before the digital supply voltage (VDD). Also, make sure to tie the EN pin high to enable the device. Additionally, configure the device according to the desired mode of operation (e.g., slave or master) by setting the appropriate pins (e.g., SCL, SDA, and INT).
  • The LTC2856 has a maximum junction temperature (TJ) of 150°C. To prevent overheating, ensure good thermal conductivity between the IC and the PCB by using a thermal pad or thermal vias. Keep the device away from heat sources, and use a heat sink if necessary. Monitor the device's temperature using the thermal monitoring pin (TMP) and take corrective action if the temperature exceeds the recommended limit.
  • To troubleshoot issues with the LTC2856, start by verifying the power supply and clock signals. Check the device's configuration and register settings using a logic analyzer or oscilloscope. Verify that the communication protocol (e.g., I2C or SPI) is correctly implemented and that the device is properly addressed. Use the device's built-in diagnostic features, such as the BIST (Built-In Self-Test) mode, to identify potential issues.
  • Yes, the LTC2856 is a high-frequency device and requires proper EMI/EMC design considerations. Use a shielded enclosure, and ensure that the PCB layout is designed to minimize radiation. Use EMI filters or common-mode chokes to reduce emissions. Follow the datasheet's guidelines for decoupling and bypassing to minimize noise and radiation.

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LTC2856IMS8-2#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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