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LTC3765HMSE#TRPBF - Analog Devices

Description: Active Clamp Forward Controller and Gate Driver

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PCB Footprints
LTC3765HMSE#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 16-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1667 Rev F)
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LTC3765HMSE#TRPBF Details

  • Manufacturer Part Number:

    LTC3765HMSE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1667

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    POWER SUPPLY SUPPORT CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    14.5 V

  • Supply Voltage-Min (Vsup):

    7.7 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC3765HMSE#TRPBF Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the VIN pin is 40V, but it's recommended to keep it below 36V for reliable operation.
  • To minimize EMI, it's recommended to keep the high-frequency switching nodes (e.g., SW, VIN, and VOUT) away from sensitive analog nodes, use a solid ground plane, and keep the layout symmetrical. Additionally, use a common-mode choke or ferrite bead on the input and output lines to reduce EMI radiation.
  • The recommended capacitor type for the VOUT filter capacitor is a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 10uF to 22uF. The exact value depends on the output voltage and current requirements.
  • The output voltage can be configured by connecting a resistive divider network between the VOUT pin and the GND pin, and then connecting the center tap of the divider to the FB pin. The ratio of the resistors determines the output voltage.
  • The maximum current that can be drawn from the VOUT pin depends on the input voltage and the output voltage. The maximum output current is typically limited to 2A, but it can be higher or lower depending on the specific application and thermal considerations.

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LTC3765HMSE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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