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LTC7860MPMSE#PBF - Analog Devices

Description: Overvoltage/Surge Protection IC Adjustable External Switch 12-MSOP-EP

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LTC7860MPMSE#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC7860MPMSE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 12-Lead Plastic MSOP, Exposed Die Pad-
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LTC7860MPMSE#PBF Details

  • Manufacturer Part Number:

    LTC7860MPMSE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    05-08-1666

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INPUT FAULT PROTECTION CONTROLLER

  • JESD-30 Code:

    R-PDSO-G12

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP12,.19

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    60 V

  • Supply Voltage-Min (Vsup):

    3.5 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

LTC7860MPMSE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC7860 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a Kelvin connection for the sense lines and to keep the high-frequency switching nodes away from sensitive analog nodes.
  • The selection of external components for the LTC7860 depends on the specific application requirements, such as the input voltage, output voltage, and output current. A good starting point is to use the component values recommended in the datasheet, and then adjust them based on the specific application requirements. It's also recommended to use components with low ESR and high ripple current ratings.
  • The LTC7860 can operate at ambient temperatures up to 125°C, but the maximum junction temperature should not exceed 150°C. It's recommended to use a heat sink or other thermal management techniques to keep the junction temperature within the recommended range.
  • Troubleshooting issues with the LTC7860 involves using a combination of measurement tools, such as oscilloscopes and spectrum analyzers, to identify the source of the problem. It's also recommended to check the PCB layout, component values, and input/output connections to ensure that they are correct and meet the recommended specifications.
  • Yes, the LTC7860 is qualified for use in high-reliability and automotive applications. It meets the requirements of the AEC-Q100 standard and is available in a variety of package options, including a 32-lead QFN package that is suitable for high-reliability applications.

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LTC7860MPMSE#PBF Overview

Use the download button to access the LTC7860MPMSE#PBF schematic symbol and PCB footprint.
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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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