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MAX14770EGSA+ - Analog Devices

Description: IC TRANSCEIVER HALF 1/1 8SOIC

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MAX14770EGSA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8+4
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MAX14770EGSA+ - Analog Devices  - 3D model - Small Outline Packages - S8+4
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MAX14770EGSA+ Details

  • Manufacturer Part Number:

    MAX14770EGSA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2009-11-13

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Interface IC Type:

    LINE TRANSCEIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    2.1 V

  • Output Low Current-Max:

    0.006 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    28 ns

  • Supply Current-Max:

    4 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MAX14770EGSA+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX14770EGSA+ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated layer for the analog signals, and to minimize the length of the traces connecting the device to the power source and load.
  • To ensure proper power-up and configuration, it's recommended to follow a specific power-up sequence, which involves applying the power supply voltage (VCC) before the input voltage (VIN). Additionally, the EN pin should be pulled high after VCC is stable, and the device should be configured through the I2C interface after the power-up sequence is complete.
  • The MAX14770EGSA+ can deliver up to 2A of current to the load, depending on the input voltage and output voltage settings. In case of an overcurrent condition, the device has a built-in overcurrent protection (OCP) feature that limits the output current to prevent damage to the device or the load.
  • The MAX14770EGSA+ has a built-in thermal shutdown feature that turns off the device when the junction temperature exceeds 150°C. The device will automatically restart when the junction temperature drops below 130°C. It's recommended to ensure good thermal design and heat dissipation to prevent thermal shutdown.
  • The recommended input capacitor value for the MAX14770EGSA+ is 10uF to 22uF, with a low ESR (Equivalent Series Resistance) and a voltage rating that matches the input voltage. A good quality input capacitor helps to filter out noise and ripple, and ensures stable operation of the device.

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MAX14770EGSA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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