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MAX14783EASA+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX14783EASA+ - RS422/RS485 TXRX, 42MBPS, 5.5V, NSOIC-8

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MAX14783EASA+ - Analog Devices - PCB symbol
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MAX14783EASA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MAX14783EASA+
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MAX14783EASA+ - Analog Devices - 3D model - Small Outline Packages - MAX14783EASA+
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MAX14783EASA+ Details

  • Manufacturer Part Number:

    MAX14783EASA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2013-06-28

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    25 ns

  • Receiver Number of Bits:

    1

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    20 ns

MAX14783EASA+ Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX14783EASA+ involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended. Additionally, the device should be placed near the power source to minimize voltage drops.
  • To optimize the performance of the MAX14783EASA+ in a high-temperature environment, ensure good thermal management by providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device away from heat sources. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • When using the MAX14783EASA+, consider using shielding, filtering, and grounding techniques to minimize EMI and RFI. Use a shielded enclosure, and ensure that the device is properly grounded to the chassis. Additionally, use ferrite beads or common-mode chokes to filter out high-frequency noise on the input and output lines.
  • To troubleshoot issues with the MAX14783EASA+, start by verifying the power supply voltage and ensuring that it is within the recommended range. Check the input and output voltage levels, and verify that the device is properly configured. Use an oscilloscope to check for noise, ringing, or other anomalies on the input and output lines. Consult the datasheet and application notes for troubleshooting guides and FAQs.
  • When using the MAX14783EASA+, consider the following PCB assembly and manufacturing considerations: use a reflow soldering process, ensure proper solder joint formation, and avoid overheating the device during assembly. Use a PCB material with a high glass transition temperature (Tg) to minimize warpage and ensure reliable operation.

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MAX14783EASA+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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