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MAX3318ECDBR - Texas Instruments

Description: 2.5-V 460-KBPS RS-232 Transceiver with IEC 61000-4-2 ESD-Protection

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MAX3318ECDBR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DB0020A
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MAX3318ECDBR - Texas Instruments  - 3D model - Small Outline Packages - DB0020A
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MAX3318ECDBR Details

  • Manufacturer Part Number:

    MAX3318ECDBR

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    GREEN, SSOP-20

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Differential Output:

    NO

  • Driver Number of Bits:

    2

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    7.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    7.4 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.0005 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP20,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Max:

    3 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Supply Voltage1-Max:

    3 V

  • Supply Voltage1-Min:

    2.25 V

  • Supply Voltage1-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

MAX3318ECDBR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the signal traces as short as possible. Additionally, it's recommended to use a common-mode choke and a ferrite bead to filter out high-frequency noise.
  • The MAX3318ECDBR requires a 50Ω termination resistor at the receiver end for high-speed signals. It's also recommended to use a series termination resistor at the transmitter end to match the impedance of the transmission line.
  • The maximum cable length supported by the MAX3318ECDBR depends on the signal frequency and the type of cable used. As a general rule, the maximum cable length is around 10-15 meters for a 100Mbps signal, but it's recommended to consult the datasheet and perform signal integrity simulations to determine the maximum cable length for a specific application.
  • The MAX3318ECDBR can be configured for half-duplex or full-duplex operation by setting the MODE pin high or low, respectively. In half-duplex mode, the transmitter and receiver are multiplexed onto a single pair of wires, while in full-duplex mode, the transmitter and receiver are separate and can operate simultaneously.
  • The power consumption of the MAX3318ECDBR depends on the operating mode and the signal frequency. In general, the power consumption is around 150mA at 3.3V. To reduce power consumption, it's recommended to use the low-power mode, reduce the signal frequency, or use a lower supply voltage.

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MAX3318ECDBR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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