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MAX3318EIDBR - Texas Instruments

Description: 2.5-V 460-KBPS RS-232 Transceiver with IEC 61000-4-2 ESD-Protection

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MAX3318EIDBR - Texas Instruments - PCB symbol
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PCB Footprints
MAX3318EIDBR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DB (R-PDSO-G20)
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MAX3318EIDBR - Texas Instruments - 3D model - Small Outline Packages - DB (R-PDSO-G20)
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MAX3318EIDBR Details

  • Manufacturer Part Number:

    MAX3318EIDBR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    SSOP-20

  • Pin Count:

    20

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    NO

  • Driver Number of Bits:

    2

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    7.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    7.4 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.0005 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP20,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Max:

    3 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    2.5 V

  • Supply Voltage1-Max:

    3 V

  • Supply Voltage1-Min:

    2.25 V

  • Supply Voltage1-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.3 mm

MAX3318EIDBR Frequently Asked Questions (FAQs)

  • The MAX3318EIDBR is a high-speed device, and proper layout and placement are crucial for optimal performance. TI recommends placing the device close to the signal source, using short traces, and avoiding vias and stubs. A solid ground plane and decoupling capacitors are also essential. Refer to the TI application note 'PCB Layout Guidelines for High-Speed Analog-to-Digital Converters' for more information.
  • The MAX3318EIDBR outputs 18-bit data in a parallel format. The digital output data should be captured and processed by a microcontroller or FPGA. The data can be processed in real-time or stored in a buffer for later processing. It's essential to ensure that the receiving device can handle the high-speed data output from the MAX3318EIDBR.
  • The MAX3318EIDBR requires a specific power sequencing to ensure proper operation. The analog supply voltage (AVDD) should be powered up before the digital supply voltage (DVDD). The power-down sequence should be reversed. Refer to the datasheet for more information on power sequencing requirements.
  • The MAX3318EIDBR does not require calibration in the classical sense. However, it's essential to ensure that the device is properly configured and that the input signal is within the specified range. The device has an internal calibration circuit that ensures accurate performance. Refer to the datasheet for more information on configuration and input signal requirements.
  • The MAX3318EIDBR is a high-power device and requires proper thermal management to ensure reliable operation. The device has a maximum junction temperature of 150°C. Ensure that the device is mounted on a suitable heat sink, and the PCB is designed to dissipate heat efficiently. Refer to the datasheet for more information on thermal management requirements.

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MAX3318EIDBR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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