12 X 12 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-186
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8542.39.00.01
Factory Lead Time:
20 Weeks
Manufacturer:
NXP Semiconductors
YTEOL:
5
Adjustable Threshold:
YES
Analog IC - Other Type:
INTEGRATED POWER MANAGEMENT UNIT
JESD-30 Code:
S-PBGA-B186
JESD-609 Code:
e2
Length:
12 mm
Moisture Sensitivity Level:
3
Number of Channels:
1
Number of Functions:
1
Number of Terminals:
186
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
LFBGA
Package Equivalence Code:
BGA186,14X14,32
Package Shape:
SQUARE
Package Style:
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.6 mm
Supply Current-Max (Isup):
1.5 mA
Supply Voltage-Max (Vsup):
3.6 V
Supply Voltage-Min (Vsup):
1.8 V
Supply Voltage-Nom (Vsup):
3.6 V
Surface Mount:
YES
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin/Silver (Sn/Ag)
Terminal Form:
BALL
Terminal Pitch:
0.8 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
40
Width:
12 mm
MC13892DJVL Frequently Asked Questions (FAQs)
A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
Use a reliable communication protocol such as I2C or SPI, and ensure proper signal termination and routing. Also, consider using a common clock source and synchronizing the devices.
The device has a thermal pad on the bottom, so ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Keep the ambient temperature within the recommended range (–40°C to 85°C).
Ensure that the power supplies are sequenced correctly, with the analog supply (VDDA) powered up before the digital supply (VDDD). Also, use a reset signal to initialize the device and ensure that it is held in reset until the power supplies are stable.
The device has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly. Use ESD-protective packaging and handling equipment, and ensure that the device is not exposed to static electricity.
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MC13892DJVL Overview
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About NXP
NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more.
NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.
