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MMBF170LT1G - onsemi

Description: RoHS Compliant

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PCB Footprints
MMBF170LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 2N7002KT1G
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MMBF170LT1G - onsemi  - 3D model - SOT23 (3-Pin) - 2N7002KT1G
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MMBF170LT1G Details

  • Manufacturer Part Number:

    MMBF170LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    TO-236, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6.5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.5 A

  • Drain-source On Resistance-Max:

    5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.225 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MMBF170LT1G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MMBF170LT1G is -55°C to 150°C.
  • To ensure reliability, follow proper storage and handling procedures, use a clean and dry environment, and avoid exceeding the maximum ratings specified in the datasheet.
  • The recommended soldering temperature is 260°C (500°F) for 10 seconds, with a maximum of 3 reflows.
  • Yes, the MMBF170LT1G can be used in switching applications, but ensure that the switching frequency is within the recommended range and that the device is properly biased.
  • Power dissipation can be calculated using the formula: Pd = (Vce * Ic) + (Vbe * Ib), where Vce is the collector-emitter voltage, Ic is the collector current, Vbe is the base-emitter voltage, and Ib is the base current.

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MMBF170LT1G Overview

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Part Image MMBF170LT1G Rochester Electronics LLC

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500mA, 60V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236AB, ROHS COMPLIANT, TO-236, CASE 318-08, 3 PIN

Part Image MMBF170LT3G onsemi

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Part Image MMBF170LT1 onsemi

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For a full list of alternate parts for MMBF170LT1G, check out Findchips.com