MSP430F2330IYFFR - Texas Instruments

MSP430F2330IYFFR Details

• Manufacturer Part Number:

  MSP430F2330IYFFR

• Brand Name:

  Texas Instruments

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Pin Count:

  49

• HTS Code:

  8542.31.00.20

• Manufacturer:

  Texas Instruments

• YTEOL:

  0

• Bit Size:

  16

• CPU Family:

  MSP430

• JESD-30 Code:

  S-PBGA-B49

• JESD-609 Code:

  e1

• Moisture Sensitivity Level:

  1

• Number of Terminals:

  49

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA49,7X7,16

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (bytes):

  1024

• ROM (words):

  8192

• ROM Programmability:

  FLASH

• Speed:

  16 MHz

• Supply Current-Max:

  0.55 mA

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.4 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC