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MSP430F5522IRGCT - Texas Instruments

Description: 25 MHz MCU with Integrated USB Phy, 32KB Flash, 8KB RAM, 12Bit/10 Channel ADC, 32BIT HW Multiplier

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PCB Footprints
MSP430F5522IRGCT - Texas Instruments PCB footprint - Other - Other - QFN50P900X900X100-65N
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3D Models
MSP430F5522IRGCT - Texas Instruments  - 3D model - Other - QFN50P900X900X100-65N
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MSP430F5522IRGCT Details

  • Manufacturer Part Number:

    MSP430F5522IRGCT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    VQFN-64

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    MSP430

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    3

  • Number of I/O Lines:

    47

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    64

  • Number of Timers:

    4

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    8192

  • RAM (words):

    8

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1 mm

  • Speed:

    25 MHz

  • Supply Current-Max:

    11 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MSP430F5522IRGCT Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MSP430F5522IRGCT is -40°C to 85°C, but it can be extended to -40°C to 105°C with some limitations on the clock frequency and supply voltage.
  • The internal oscillator on the MSP430F5522IRGCT can be configured using the UCSCTL0, UCSCTL1, and UCSCTL2 registers. The oscillator frequency can be set to 1 MHz, 5 MHz, 10 MHz, or 20 MHz, and the clock source can be selected as either the internal oscillator or an external clock source.
  • The maximum current consumption of the MSP430F5522IRGCT depends on the operating mode and clock frequency. In active mode, the maximum current consumption is around 2.1 mA at 20 MHz and 3.3 V. In low-power mode, the current consumption can be as low as 0.2 μA.
  • The MSP430F5522IRGCT has a built-in USB interface that can be used to communicate with a host device. The USB interface is controlled by the USB Device Controller (UDC) module, and it supports USB 2.0 full-speed and low-speed modes. The UDC module provides a set of registers and interrupts that can be used to manage USB transactions and handle USB requests.
  • The JTAG (Joint Test Action Group) interface on the MSP430F5522IRGCT is used for debugging and testing purposes. It allows developers to access the device's internal registers and memory, and to perform boundary scan testing. The JTAG interface is also used for programming the device's flash memory.

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MSP430F5522IRGCT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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