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MUN2232T1G - onsemi

Description: Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
MUN2232T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-59 CASE 318D-04..
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3D Models
MUN2232T1G - onsemi  - 3D model - SOT23 (3-Pin) - SC-59 CASE 318D-04..
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MUN2232T1G Details

  • Manufacturer Part Number:

    MUN2232T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-59 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    15

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.338 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MUN2232T1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the MUN2232T1G is a 2.5mm x 1.3mm pad with a 0.5mm radius corner, and a 0.3mm x 0.3mm thermal pad in the center.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its recommended operating temperature range (-40°C to 150°C), and that the PCB is designed to minimize thermal resistance and ensure good heat dissipation.
  • The maximum allowed voltage on the gate of the MUN2232T1G is 20V, and it is recommended to keep the gate voltage below 15V to ensure reliable operation.
  • To protect the MUN2232T1G from ESD, handle the device by the body or use an ESD wrist strap, and ensure that the PCB is designed with ESD protection in mind, such as using ESD protection diodes or resistors.
  • The recommended drive circuit for the MUN2232T1G is a non-inverting driver with a pull-up resistor and a pull-down resistor, with a recommended drive voltage of 10V to 15V.

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MUN2232T1G Overview

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