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MUN2233T1G - onsemi

Description: Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
MUN2233T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-59 CASE 318D-04
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3D Models
MUN2233T1G - onsemi  - 3D model - SOT23 (3-Pin) - SC-59 CASE 318D-04
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MUN2233T1G Details

  • Manufacturer Part Number:

    MUN2233T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-59 3 LEAD

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, CASE 318D-04, SC-59, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 10

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.338 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

MUN2233T1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the MUN2233T1G is a 1.6mm x 0.8mm pad with a 0.5mm hole in the center, and a 0.3mm keep-out zone around the pad.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its recommended operating temperature range (-40°C to 150°C), and that the PCB is designed to minimize thermal resistance and ensure good heat dissipation.
  • The maximum allowable voltage on the gate of the MUN2233T1G is 20V, and it is recommended to keep the gate voltage below 15V to ensure reliable operation.
  • To protect the MUN2233T1G from ESD, handle the device by the body or use an ESD wrist strap, and ensure that the PCB is designed with ESD protection in mind, such as using ESD protection diodes or resistors.
  • The recommended drive circuit for the MUN2233T1G is a gate driver with a high current capability (e.g. 1A) and a fast rise time (e.g. 10ns), and a gate resistor value of 10-20 ohms.

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MUN2233T1G Overview

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