A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to improve heat dissipation.
Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the device when designing the system.
The NRVBM140T1G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
Yes, the NRVBM140T1G is AEC-Q101 qualified, making it suitable for automotive applications. However, it's essential to review the device's reliability and qualification data to ensure it meets the specific requirements of your application.
Consult the onsemi application note for troubleshooting guidelines. Also, review the device's datasheet and evaluate the system design to identify potential issues. If necessary, contact onsemi's technical support for further assistance.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
NRVBM140T1G Overview
Use the download button to access the NRVBM140T1G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like NRVBM,
or try a keyword search, such as Rectifier Diodes
