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OPA2353EA/250 - Texas Instruments

Description: Dual high-speed, single-supply, rail-to-rail operational amplifiers MicroAmplifier™ series<

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OPA2353EA/250 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 5-Pin SC70
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OPA2353EA/250 - Texas Instruments  - 3D model - Small Outline Packages - 5-Pin SC70
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OPA2353EA/250 Details

  • Manufacturer Part Number:

    OPA2353EA/250

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    76 dB

  • Common-mode Reject Ratio-Nom:

    86 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    8000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    22 V/us

  • Supply Current-Max:

    16 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    44000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3 mm

OPA2353EA/250 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA2353EA/250 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the power pins. A 4-layer PCB with a dedicated ground plane is recommended.
  • The choice of gain resistors depends on the desired gain and bandwidth. A good starting point is to use the recommended values in the datasheet, and then adjust them based on the specific application requirements. It's also important to consider the resistor noise and tolerance.
  • The maximum power dissipation of OPA2353EA/250 is 670mW. However, this can be limited by the thermal resistance of the package and the PCB. It's essential to ensure good thermal management to prevent overheating.
  • Yes, OPA2353EA/250 can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance to prevent signal attenuation. Additionally, the output impedance should be considered when driving a load.
  • To filter out noise and interference, use a combination of passive and active filtering techniques. Add capacitors to filter out high-frequency noise, and consider using a ferrite bead or a common-mode choke to filter out electromagnetic interference.

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OPA2353EA/250 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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