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OPA2369AIDCNT - Texas Instruments

Description: Texas Instruments OPA2369AIDCNT, Dual Op Amp, 0.012MHz Rail-Rail, 3 V, 5 V, 8-Pin SOT-23

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PCB Footprints
OPA2369AIDCNT - Texas Instruments PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - DCN (R-PDSO-G8)
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3D Models
OPA2369AIDCNT - Texas Instruments  - 3D model - SOT23 (8-Pin) - DCN (R-PDSO-G8)
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OPA2369AIDCNT Details

  • Manufacturer Part Number:

    OPA2369AIDCNT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    114 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00005 µA

  • Input Offset Voltage-Max:

    750 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSSOP8,.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.005 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.002 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    12

  • Voltage Gain-Min:

    31600

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA2369AIDCNT Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA2369AIDCNT involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, use a gain resistor (Rg) that is less than or equal to 1 kΩ, and a feedback capacitor (Cf) that is less than or equal to 10 pF. Additionally, ensure that the output impedance of the previous stage is low enough to drive the input of the OPA2369AIDCNT.
  • The maximum power dissipation of OPA2369AIDCNT is 750 mW. However, this can be limited by the thermal resistance of the package and the ambient temperature. It's essential to calculate the power dissipation and ensure it's within the safe operating area.
  • Yes, OPA2369AIDCNT is rated for operation from -40°C to 125°C. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature should not exceed 150°C.
  • To protect OPA2369AIDCNT from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, use a low-pass filter or a shielded cable to reduce radiated emissions.

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OPA2369AIDCNT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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