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OPA381AIDRBR - Texas Instruments

Description: High Speed Operational Amplifiers Precision Lo-Power Hi-Sp Transimpedance

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OPA381AIDRBR - Texas Instruments - PCB symbol
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PCB Footprints
OPA381AIDRBR - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - DRB0008B
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3D Models
OPA381AIDRBR - Texas Instruments - 3D model - Small Outline No-lead - DRB0008B
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OPA381AIDRBR Details

  • Manufacturer Part Number:

    OPA381AIDRBR

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SON

  • Package Description:

    SON-8

  • Pin Count:

    8

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    0.0011 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

OPA381AIDRBR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout that minimizes parasitic inductance and capacitance, with a solid ground plane and short traces. A 4-layer PCB with a dedicated analog ground plane is recommended. See the TI application note 'AN-202' for more details.
  • The OPA381AIDRBR has internal ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • The maximum power dissipation for OPA381AIDRBR is dependent on the ambient temperature and the thermal resistance of the package. See the datasheet for the power dissipation vs. temperature graph, and ensure that the device is properly heat-sunk if necessary.
  • The OPA381AIDRBR is rated for operation up to 125°C, but the device's performance and reliability may degrade at high temperatures. Ensure that the device is properly heat-sunk and that the maximum junction temperature is not exceeded.
  • The input and output capacitors should be selected based on the specific application requirements, such as frequency response and noise filtering. A general rule of thumb is to use capacitors with a high quality factor (Q) and a low equivalent series resistance (ESR). See the TI application note 'AN-1489' for more details.

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OPA381AIDRBR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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