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OPA3S328RGRR - Texas Instruments

Description: Precision Amplifiers High-speed (40-MHz), high-precision (25-uV) , low-noise op amp with integrated gain switches

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OPA3S328RGRR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGR (S-PVQFN-N20)
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3D Models
OPA3S328RGRR - Texas Instruments  - 3D model - Quad Flat No-Lead - RGR (S-PVQFN-N20)
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OPA3S328RGRR Details

  • Manufacturer Part Number:

    OPA3S328RGRR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-11-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    96 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00002 µA

  • Input Offset Voltage-Max:

    60 µV

  • JESD-30 Code:

    S-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    3.5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -3 V

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.14SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1 mm

  • Slew Rate-Nom:

    30 V/us

  • Supply Current-Max:

    10 mA

  • Supply Voltage Limit-Max:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    40000

  • Voltage Gain-Min:

    31622.78

  • Wideband:

    NO

  • Width:

    3.5 mm

OPA3S328RGRR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the OPA3S328RGRR datasheet, which includes guidelines for component placement, routing, and grounding. Additionally, TI recommends using a 4-layer PCB with a solid ground plane and a separate analog ground plane to minimize noise and ensure optimal performance.
  • The OPA3S328RGRR has built-in ESD protection, but it's still important to follow proper handling and storage procedures to prevent damage. TI recommends using an ESD wrist strap or mat when handling the device, and storing it in an anti-static bag or container. Additionally, the device should be soldered onto a PCB with ESD protection components, such as TVS diodes or ESD protection arrays.
  • The maximum power dissipation of OPA3S328RGRR is dependent on the ambient temperature and the thermal resistance of the PCB. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature, but this can be derated to 0.7W at 85°C ambient temperature. It's essential to ensure proper thermal management and heat sinking to prevent overheating and damage to the device.
  • The OPA3S328RGRR is rated for operation from -40°C to 125°C, but its performance and reliability may be affected at high temperatures. TI recommends derating the device's power dissipation and ensuring proper thermal management to prevent overheating. Additionally, the device's specifications may vary at high temperatures, so it's essential to consult the datasheet and perform thorough testing before using the device in a high-temperature environment.
  • Common issues with OPA3S328RGRR can often be attributed to improper PCB layout, inadequate power supply decoupling, or incorrect component selection. To troubleshoot these issues, TI recommends following a systematic approach, including checking the PCB layout, verifying the power supply, and ensuring proper component selection and placement. Additionally, TI provides a range of application notes and technical resources to help engineers troubleshoot and optimize their designs.

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OPA3S328RGRR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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