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OPA4872MDREP - Texas Instruments

Description: Enhanced Product 4:1 High-Speed Multiplexer

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OPA4872MDREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 14-SOIC_2020
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OPA4872MDREP - Texas Instruments  - 3D model - Small Outline Packages - 14-SOIC_2020
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OPA4872MDREP Details

  • Manufacturer Part Number:

    OPA4872MDREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage-Max (Vsup):

    -6 V

  • Neg Supply Voltage-Min (Vsup):

    -3.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NO

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Off-state Isolation-Nom:

    88 dB

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    12.5 mA

  • Supply Voltage-Max (Vsup):

    12 V

  • Supply Voltage-Min (Vsup):

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

OPA4872MDREP Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA4872MDREP involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a reference design and layout guidelines in the datasheet and application notes.
  • The choice of gain resistors depends on the desired gain, bandwidth, and noise requirements. TI provides a gain resistor calculator tool and application notes that can help with selecting the right resistors. Additionally, the datasheet provides guidelines for selecting gain resistors based on the desired gain and bandwidth.
  • The maximum power dissipation of OPA4872MDREP is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this can be derated based on the thermal resistance of the package and the ambient temperature.
  • Yes, OPA4872MDREP is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the thermal management and derate the power dissipation accordingly to ensure reliable operation.
  • To filter out noise and interference, you can use a combination of passive and active filtering techniques. TI provides application notes and reference designs that demonstrate noise reduction techniques using OPA4872MDREP. Additionally, you can use external filters, such as RC filters or active filters, to reduce noise and interference.

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OPA4872MDREP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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