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OPA695IDBVR - Texas Instruments

Description: Ultra-Wideband, Current-Feedback Operational Amplifier with Disable

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PCB Footprints
OPA695IDBVR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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OPA695IDBVR - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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OPA695IDBVR Details

  • Manufacturer Part Number:

    OPA695IDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CURRENT-FEEDBACK

  • Bias Current-Max (IIB) @25C:

    30 µA

  • Common-mode Reject Ratio-Min:

    50 dB

  • Common-mode Reject Ratio-Nom:

    65 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    5000 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    18 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1900000

  • Wideband:

    YES

  • Width:

    1.6 mm

OPA695IDBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA695IDBVR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, ensure that the gain resistor (Rg) is less than or equal to 1 kΩ, and the feedback capacitor (Cf) is less than or equal to 10 pF. Also, use a low-ESR capacitor for decoupling and keep the layout compact.
  • The maximum power dissipation of OPA695IDBVR is 1.4 W. However, this can be limited by the thermal resistance of the package and the ambient temperature. Ensure that the device is properly heat-sinked and the ambient temperature is within the recommended range.
  • Yes, OPA695IDBVR is rated for operation up to 125°C. However, the device's performance may degrade at high temperatures, and the maximum power dissipation may be limited. Ensure that the device is properly heat-sinked and the ambient temperature is within the recommended range.
  • To protect OPA695IDBVR from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines. Also, ensure that the PCB layout is compact and the device is properly decoupled.

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OPA695IDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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