SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Power:
YES
Programmable Power:
NO
Qualification Status:
Not Qualified
Seated Height-Max:
1.45 mm
Slew Rate-Min:
1100 V/us
Slew Rate-Nom:
2900 V/us
Supply Current-Max:
13.3 mA
Supply Voltage Limit-Max:
6.5 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Technology:
BIPOLAR
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.95 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Unity Gain BW-Nom:
1700000
Wideband:
YES
Width:
1.6 mm
OPA695IDBVRG4 Frequently Asked Questions (FAQs)
Texas Instruments recommends a layout that minimizes parasitic inductance and capacitance, with a solid ground plane and short, direct traces to the input and output pins. A 4-layer PCB with a dedicated analog ground plane is recommended.
To ensure stability, use a compensation capacitor (Cc) between the output and inverting input pins, and a series resistor (Rs) at the output pin. The values of Cc and Rs depend on the specific application and can be calculated using the datasheet's stability analysis guidelines.
The maximum power dissipation of OPA695IDBVRG4 is 1.4W. To calculate it, use the formula: Pd = (Vcc x Icc) + (Vout x Iout), where Vcc is the supply voltage, Icc is the quiescent current, Vout is the output voltage, and Iout is the output current.
Yes, OPA695IDBVRG4 is specified to operate from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. Ensure that the device is properly heatsinked and follow the recommended operating conditions to minimize thermal stress.
Use ESD protection diodes and TVS (transient voltage suppression) diodes at the input and output pins to protect against electrostatic discharge and overvoltage events. Additionally, follow proper handling and storage procedures to prevent ESD damage.
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OPA695IDBVRG4 Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
