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PGA2311UA - Texas Instruments

Description: +/-5V Stereo Audio Volume Control

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PGA2311UA - Texas Instruments - PCB symbol
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PCB Footprints
PGA2311UA - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW0016A-
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3D Models
PGA2311UA - Texas Instruments - 3D model - Small Outline Packages - DW0016A-
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PGA2311UA Details

  • Manufacturer Part Number:

    PGA2311UA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Channel Separation:

    130 dB

  • Consumer IC Type:

    VOLUME CONTROL CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.285 mm

  • Moisture Sensitivity Level:

    2

  • Number of Bands:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    23 mA

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

PGA2311UA Frequently Asked Questions (FAQs)

  • The PGA2311UA requires careful layout and placement to ensure optimal performance. TI recommends placing the device close to the analog signal source, using a ground plane, and minimizing trace lengths and widths to reduce noise and parasitic inductance.
  • The optimal gain setting depends on the specific application and signal characteristics. Engineers can use the PGA2311UA's gain adjustment pins (GAIN0-GAIN2) to set the gain to one of 16 possible settings. TI provides a gain calculation formula in the datasheet to help determine the optimal gain setting.
  • TI recommends using a 10-μF ceramic capacitor and a 100-nF ceramic capacitor in parallel, placed as close as possible to the device's power pins, to decouple the power supply and reduce noise.
  • To ensure EMC, engineers should follow proper PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering as needed. TI also recommends following the IEC 61000-4-2 standard for electrostatic discharge (ESD) protection.
  • The PGA2311UA has a thermal pad that must be connected to a solid ground plane to dissipate heat. Engineers should ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or heat sinks if necessary.

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PGA2311UA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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For a full list of alternate parts for PGA2311UA, check out Findchips.com