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RF430CL331HIPWR - Texas Instruments

Description: Dynamic NFC Interface Transponder for Large File Transfer

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RF430CL331HIPWR - Texas Instruments - PCB symbol
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PCB Footprints
RF430CL331HIPWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW (R-PDSO-G14)
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3D Models
RF430CL331HIPWR - Texas Instruments - 3D model - Small Outline Packages - PW (R-PDSO-G14)
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RF430CL331HIPWR Details

  • Manufacturer Part Number:

    RF430CL331HIPWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8523.59.00.00

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    3.0-3.6 SUPPLY AVAILABLE WHEN NO RF FIELD

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Memory IC Type:

    NFC/RFID TAGS AND TRANSPONDERS

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

RF430CL331HIPWR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLAU445, which includes guidelines for component placement, trace routing, and grounding to minimize noise and ensure optimal performance.
  • To minimize power consumption, configure the device to operate in low-power mode, disable unnecessary peripherals, and use the built-in power management features such as the low-power oscillator and voltage regulator. Refer to the datasheet and application notes for specific configuration guidelines.
  • The RF430CL331HIPWR is rated for operation from -40°C to 85°C, but it's essential to consider the specific application and environmental conditions to ensure reliable operation within the specified temperature range.
  • To ensure EMC, follow proper PCB design and layout guidelines, use shielding and filtering techniques, and consider implementing electromagnetic interference (EMI) filters and shielding components. Consult the datasheet and application notes for specific EMC guidelines.
  • The recommended decoupling capacitor values are 10nF to 100nF, depending on the specific application and operating frequency. Consult the datasheet and application notes for specific decoupling capacitor recommendations.

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RF430CL331HIPWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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