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SI1308EDL-T1-BE3 - Vishay

Description: MOSFET 30V N-CHANNEL (D-S)

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PCB Footprints
SI1308EDL-T1-BE3 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-70(3LEADS)_2020
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3D Models
SI1308EDL-T1-BE3 - Vishay  - 3D model - SOT23 (3-Pin) - SC-70(3LEADS)_2020
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SI1308EDL-T1-BE3 Details

  • Manufacturer Part Number:

    SI1308EDL-T1-BE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    SOT-323, SC-70, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    1.4 A

  • Drain-source On Resistance-Max:

    0.132 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    11 pF

  • JESD-30 Code:

    R-PDSO-G3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.5 W

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI1308EDL-T1-BE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI1308EDL-T1-BE3 is a standard SOT23-6 package with a 1.8mm x 1.35mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5V to 5.5V, and the enable pin (EN) to a logic-level signal (0V or VIN). The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor to ensure stability.
  • The SI1308EDL-T1-BE3 is capable of delivering up to 1A of continuous output current. However, it's recommended to limit the output current to 0.8A for optimal reliability and thermal performance.
  • To ensure reliable operation, it's essential to provide adequate thermal management. The SI1308EDL-T1-BE3 has a thermal pad on the bottom of the package. Connect this pad to a copper plane on the PCB to dissipate heat. A thermal via or thermal pad on the PCB can also be used to improve heat dissipation.
  • The SI1308EDL-T1-BE3 has built-in ESD protection on all pins, with a human body model (HBM) rating of ±2kV and a charged device model (CDM) rating of ±500V. The device is also designed to be latch-up immune, with a rating of 100mA per JEDEC standard JESD78.

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SI1308EDL-T1-BE3 Overview

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