- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SI2337DS-T1-BE3
- Part Number SI2337DS-T1-BE3
- Manufacturer Vishay
- Pin Count 3
- Part Category MOSFET (P-Channel)
- Package Category SOT23 (3-Pin)
- Footprint Name SOT23 (3-Pin) - -SOT-23
- Released Date Jun 12, 2021
- Last Modified Date Oct 10, 2023 6:26 AM UTC
- Pinout / Pin List Click Here (Member Only)
SI2337DS-T1-BE3 Details
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Manufacturer Part Number:
SI2337DS-T1-BE3
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Package Description:
SOT-23, 3 PIN
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ECCN Code:
EAR99
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
0
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
80 V
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Drain Current-Max (ID):
1.2 A
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Drain-source On Resistance-Max:
0.27 Ω
SI2337DS-T1-BE3 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the SI2337DS-T1-BE3 is a 2x2mm QFN package with a 0.5mm pitch. A minimum of 4 thermal vias under the exposed pad is recommended for optimal thermal performance.
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To ensure the device operates within the recommended operating conditions, ensure the input voltage is within the specified range (1.8V to 3.6V), and the junction temperature is below the maximum rating (125°C). Additionally, follow proper PCB design and layout guidelines to minimize thermal resistance and ensure adequate heat dissipation.
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The maximum allowable power dissipation for the SI2337DS-T1-BE3 is 1.4W. However, this value may vary depending on the specific application and operating conditions. It is essential to perform thermal analysis and ensure the device operates within the recommended power dissipation limits to prevent overheating and ensure reliability.
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Yes, the SI2337DS-T1-BE3 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 qualification standard and is suitable for use in harsh environments. However, it is essential to consult with Vishay Intertechnologies or an authorized distributor for specific application guidance and to ensure compliance with relevant industry standards.
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The exposed pad on the SI2337DS-T1-BE3 is a thermal pad that should be connected to a solid ground plane on the PCB to ensure optimal thermal performance. A minimum of 4 thermal vias under the exposed pad is recommended to dissipate heat efficiently.
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SI2337DS-T1-BE3 Overview
Use the download button to access the SI2337DS-T1-BE3 schematic symbol, PCB footprint, and 3D model.
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