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SLP271M200A1P3 - Cornell Dubilier

Description: Cornell-Dubilier 270μF 200 V dc Aluminium Capacitor A1, SLP Series 1000 (Shelf) h, 3000 (Endurance) h 22 x 25mm

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SLP271M200A1P3 - Cornell Dubilier - PCB symbol
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PCB Footprints
SLP271M200A1P3 - Cornell Dubilier PCB footprint - Capacitor, Polarized Radial Diameter - Capacitor, Polarized Radial Diameter - 22*2545
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3D Models
SLP271M200A1P3 - Cornell Dubilier - 3D model - Capacitor, Polarized Radial Diameter - 22*2545
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SLP271M200A1P3 Details

  • Manufacturer Part Number:

    SLP271M200A1P3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.22.00.40

  • Manufacturer:

    Cornell Dubilier Electronics Inc

  • YTEOL:

    6

  • Capacitance:

    270 µF

  • Capacitor Type:

    ALUMINUM ELECTROLYTIC CAPACITOR

  • Diameter:

    22 mm

  • Dielectric Material:

    ALUMINUM (WET)

  • ESR:

    737 mΩ

  • JESD-609 Code:

    e3

  • Leakage Current:

    0.6971 mA

  • Length:

    25 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Snap-in

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    200 V

  • Ripple Current:

    1100 mA

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Pitch:

    10 mm

  • Terminal Shape:

    SNAP-IN

SLP271M200A1P3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SLP271M200A1P3 is a rectangular pad with dimensions of 27.5mm x 17.5mm, with a 1.5mm keep-out zone around the perimeter. The pad should have a thickness of 0.5mm to 1.5mm to ensure good thermal conductivity.
  • To ensure proper thermal management, it is recommended to provide a heat sink or thermal pad under the component, and to ensure good airflow around the device. The thermal pad should have a thermal conductivity of at least 1 W/m-K, and the heat sink should have a thermal resistance of less than 10°C/W.
  • The maximum operating temperature range for the SLP271M200A1P3 is -40°C to +125°C, with a derating of 1.25% per °C above 80°C.
  • Yes, the SLP271M200A1P3 is designed to withstand high-vibration applications, with a vibration rating of 10G peak acceleration, 10-2000 Hz, and 3 axes.
  • The recommended soldering profile for the SLP271M200A1P3 is a peak temperature of 260°C, with a dwell time of 30-60 seconds, and a ramp rate of 3°C/second.

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SLP271M200A1P3 Overview

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