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SM73201IMM/NOPB - Texas Instruments

Description: 16-Bit, 50 to 250 kSPS, Differential Input, MicroPower ADC

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SM73201IMM/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A
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SM73201IMM/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGS0010A
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SM73201IMM/NOPB Details

  • Manufacturer Part Number:

    SM73201IMM/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    TSSOP-10

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Input Voltage-Max:

    5.5 V

  • Analog Input Voltage-Min:

    -0.5 V

  • Conversion Time-Max:

    17 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.00122%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.25 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.001 mA

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

SM73201IMM/NOPB Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the thermal pad is connected to a large copper area to improve heat dissipation.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow proper PCB design and layout guidelines, including proper thermal management, decoupling, and signal integrity considerations. Additionally, ensure that the device is operated within the recommended operating conditions and that the input voltage is within the specified range.
  • The critical timing parameters for the SM73201IMM/NOPB include the input rise and fall times, output rise and fall times, and the minimum input pulse width. To ensure these parameters are met, it is essential to follow the recommended PCB design and layout guidelines, including proper signal routing, termination, and decoupling.
  • To handle ESD protection for the SM73201IMM/NOPB, it is recommended to follow proper ESD handling procedures during device handling and assembly. Additionally, consider adding external ESD protection devices, such as TVS diodes or ESD arrays, to protect the device from electrostatic discharge events.
  • The recommended power sequencing and ramp-up times for the SM73201IMM/NOPB can be found in the device datasheet. In general, it is recommended to power up the device slowly, with a ramp-up time of at least 1 ms, to ensure proper device operation and to prevent latch-up or other damage.

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SM73201IMM/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image ADC161S626CIMME/NOPB National Semiconductor Corporation

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Part Image ADC161S626CIMME Texas Instruments

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For a full list of alternate parts for SM73201IMM/NOPB, check out Findchips.com